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    The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air...

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    Fine grinding of etched wafers first appeared in public. 163 domain through ...... [21] M.C. Shaw, Principles of Abrasive Processing, Oxford University. 541. Press...

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    May 7, 2018 ... Ultra precision grinding based on the principle of wafer rotation grinding is currently utilized as a major back thinning technique due to its high...

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    Jun 20, 2017 ... Therefore, a modern wafer grinding machine begins with a coarse grinding wheel to get ... Measurement principle and surface characterization.

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    May 7, 2008 ... and the wafer front surface before the wafer is removed from the chuck after ...... double disk grinding: operation principle and material removal.

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    DDG: principle. In simultaneous double disk grinding, both sides of the wafer are ground, simultaneously in a single process step and one wafer at a time...

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